C1不仅支持3D打印聚合物工件的全自动后处理,还支持对所有工艺参数进行连续监测。标准系统控制包含用于从不同的3D打印工件移除支撑结构/树脂的各种处理程序。然而,控制也允许开发特殊的处理程序并将其存储在PLC中。C1还配备了液位传感器和全自动介质补充系统。载体/树脂去除过程基于化学、热和机械效应原理。这些机制的完美相互作用确保了即使是最脆弱和最紧密的区域的支撑材料/树脂也能以安全可靠的方式快速去除,而不会影响工件的完整性。
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