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Performance Improvement and Technological Innovation for 3D Printed Biomedical Titanium Materials
【Abstract】
1. We have greatly improved the mechanical properties of various biomedical titanium materials, including pure Ti.
2. We have Developed a novel method and corresponding device that can effectively remove loose powder/adhesive powder from the surfaces of 3D printed porous medical implants.
3. We have achieved ultra-high osteogenic activity in 3D printed medical titanium materials.
【Bio】
Dr. Yan Ming mainly completed his undergraduate and doctoral studies at Harbin Institute of Technology, and during his doctoral studies, he went to the University of Queensland in Australia for joint training. After obtaining his Ph.D., he worked successively at the National Institute for Materials Science in Japan, the University of Queensland and RMIT University. He returned to China in December 2014 and successively held positions as a doctoral supervisor, associate professor, tenured associate professor and tenured full professor in Materials Science and Engineering at Southern University of Science and Technology.
Professor Yan Ming has published two books, five English book chapters, and over 200 SCI journal papers, which have been cited more than 8,000 times. The main awards he has received include the First Prize of Guangxi Science and Technology (Technological Invention), the "Top 2% Global Scientists List" and the "Lifetime Scientific Influence List" of Stanford University in the United States, the Humboldt Scholar (Senior) Scholarship of Germany, the Japan Society for the Promotion of Science Scholarship, and the Queensland Young Scholar Scholarship. Dr. Yan Ming serves in the academic journal Advanced Powder Materials Editorial Board member (IF=28.6), Director of the "Shenzhen Aero-Engine 3D Printing Powder Engineering Laboratory", Member of the Academic Committee of the "Guangdong Additive Manufacturing Association", and engineering Expert of the "3D Printing Medical Device Professional Committee of the China Medical Device Industry Association".
